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TPD4S1394

SLVSA55B – NOVEMBER 2009 – REVISED NOVEMBER 2016

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6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

PARAMETER

MIN

MAX

UNIT

VCC

Supply voltage

3

3.6

V

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

TPD4S1394

UNIT

DQL (X2SON)

8 PINS

RθJA

Junction-to-ambient thermal resistance

167.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

56.8

°C/W

RθJB

Junction-to-board thermal resistance

82.3

°C/W

ψJT

Junction-to-top characterization parameter

1.5

°C/W

ψJB

Junction-to-board characterization parameter

82

°C/W

(1)

A 0.1-µF decoupling capacitor is required at VCC.

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)

(1)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

VDX

FWPWR_EN trip voltage

(D+ and D– pins)

High-to-low

2.9

3.4

4

V

Low-to-high

2.7

3.2

3.8

VCLMP

Value on pin

No connection

2.45

V

VBR

Breakdown voltage at VCLAMP

II = 1 mA

4.2

V

VD

Diode forward voltage for lower clamp

ID = 8 mA lower clamp diode

–0.6

–0.8

–0.95

V

FWPWR_EN

Switch output

VCC

V

RDYN

Dynamic resistance (in and out clamp) of D+, D–

I = 1 A

1

Ω

CIO

I/O capacitance of D+, D–

VIO = 2.5 V

1.5

2

pF

ICC

Current consumption

VCC = 3.3 V, FWPWR_EN = high

130

200

µA

6.6 Switching Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

tTRIP

Delay time for FWPWR_EN to go low

Loading on FWPWR_EN = 50 pF

0.5

2

5

µs

tRESET

Delay time for FWPWR_EN to go high after trip

FWPWR_EN = VCC

300

450

600

ms