LP8551

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SNVS673E – APRIL 2010 – REVISED SEPTEMBER 2014

7 Specifications

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VIN

–0.3

24

VLDO

–0.3

6

Voltage on logic pins (PWM, EN, SCLK, SDA)

–0.3

6

V

Voltage on logic pin (FAULT)

–0.3

to VDDIO + 0.3

Voltage on analog pins (VDDIO, ISET, FSET)

–0.3

6

V (OUT1...OUT4, SW, FB)

–0.3

44

Continuous power dissipation(2)

Internally limited

Junction temperature (TJ-MAX)

125

°C

Maximum lead temperature (soldering)(3)

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 150°C (typ.) and

disengages at TJ = 130°C (typ.).

(3)

For detailed soldering specifications and information, please refer to TI's AN-1112 (SNVA009): DSBGA Wafer Level Chip Scale

Package.

7.2 Handling Ratings

MIN

MAX

UNIT

Tstg

Storage temperature range

–65

150

°C

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

–2000

2000

pins(1)

V(ESD)

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification

–1000

1000

JESD22-C101, all pins(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

(1) (2)

Over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input voltage (VIN) (Figure 22)

5.5

22

Input voltage (VIN + VLDO)(Figure 25)

4.5

5.5

V

VDDIO

1.65

5

V(OUT1 to OUT4, SW, FB)

0

40

Junction temperature (TJ)

–30

125

°C

Ambient temperature (TA)

(3)

–30

85

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pins.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the

part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).

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