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MLPF-WB-01D3 Datasheet(PDF) 5 Page - STMicroelectronics |
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MLPF-WB-01D3 Datasheet(HTML) 5 Page - STMicroelectronics |
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5 / 13 page ![]() 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 CSPG package information Figure 9. CSPG package outline (bottom view - bumps up) Table 4. CSPG 6 bumps mechanical data Ref. Dimensions Millimeters Min. Typ. Max. A 0.580 0.630 0.680 A1 0.180 0.205 0.230 A2 0.380 0.400 0.420 b 0.230 0.255 0.280 D 1.550 1.600 1.650 D1 0.577 D2 0.577 E 0.950 1.000 1.050 E1 0.500 fD1 0.223 fD2 0.223 fE1 0.250 fE2 0.250 MLPF-WB-01D3 Package information DS14236 - Rev 1 page 5/13 |
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