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MLPF-WB-01D3 Datasheet(PDF) 8 Page - STMicroelectronics |
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MLPF-WB-01D3 Datasheet(HTML) 8 Page - STMicroelectronics |
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8 / 13 page ![]() 3 Recommendation on PCB assembly 3.1 Land pattern Layout example using STM32WB15CCU. Figure 13. PCB land pattern recommendations The transmission line between MLPF and antenna is dimensioned to 50 ohms characteristic impedance. The transmission line between STM32 is dimensioned to 67 ohms characteristic impedance. These transmission line characteristic impedances have to be followed as close as possible. Moreover, lines physical dimensions will have to be tuned according to specific PCB stack-up, if different from the one presented in datasheet, to keep expected characteristic impedance values. The ground plane vias density needs to be maximized near the MLPF-WB-01D3 area to ensure optimal RF performances. Figure 14. PCB stack-up recommendations MLPF-WB-01D3 Recommendation on PCB assembly DS14236 - Rev 1 page 8/13 |
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