LM5045

SNVS699H – FEBRUARY 2011 – REVISED JANUARY 2015

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6 Specifications

6.1 Absolute Maximum Ratings

(1)

MIN

MAX

UNIT

VIN to GND

–0.3

105

V

HS to GND(2)

–5

105

V

BST1/BST2 to GND

–0.3

116

V

BST1/BST2 to HS1/HS2

–0.3

16

V

HO1/HO2 to HS1/HS2(3)

–0.3

BST1/BST2 + 0.3

V

LO1/LO2/SR1/SR2(3)

–0.3

VCC + 0.3

V

VCC to GND

–0.3

16

V

REF,SSOFF,RT,OVP,UVLO to GND

–0.3

7

V

RAMP

–0.3

7

V

COMP

–0.3

V

COMP Input Current

10

mA

All other inputs to GND(3)

–0.3

REF + 0.3

V

Junction Temperature

150

°C

Storage temperature, Tstg

–55

150

°C

(1)

Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which

operation of the device is intended to be functional. For ensured specifications and test conditions, see the Electrical Characteristics.

(2)

The negative HS voltage must never be more negative than VCC–16 V. For example, if VCC = 12 V, the negative transients at HS must

not exceed –4 V.

(3)

These pins are output pins and as such should not be connected to an external voltage source. The voltage range listed is the limits the

internal circuitry is designed to reliably tolerate in the application circuit.

6.2 ESD Ratings

VALUE

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V(ESD)

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±750

C101(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN Voltage

14

100

V

External Voltage Applied to VCC

10

14

V

Junction Temperature

–40

125

°C

SLOPE

–0.3

2

V

6.4 Thermal Information

LM5045

THERMAL METRIC(1)

PWP

RSG

UNIT

28 PINS

RθJA

Junction-to-ambient thermal resistance

40

40

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

4

4

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6

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