| Electronic Components Datasheet Search |
|
HS0-117RH/SAMPLE Datasheet(PDF) 10 Page - Renesas Technology Corp |
|
|
|||||||||||||||||||||||||||||
HS0-117RH/SAMPLE Datasheet(HTML) 10 Page - Renesas Technology Corp |
|
10 / 16 page ![]() HS-117RH, HS-117EH FN4560 Rev.11.01 Page 10 of 15 Aug 12, 2025 When developing circuits using the HS-117, test thermal performance and limitations to ensure acceptable performance. As with all tabbed packaged devices, flange mounting to a thermal heat-sink is recommended for the TO-257AA best practices. T0-257AA Package Characteristics Weight of Packaged Device 4.50g (Typical) Case Characteristics Finish: Gold Potential: Unbiased T0-39 Package Characteristics Weight of Packaged Device 0.91g (Typical) Case Characteristics Finish: Steel, Gold Potential: Unbiased SMD.5 CLCC Package Characteristics Weight of Packaged Device 0.91g (Typical) Case Characteristics Finish: Gold, Ceramic Potential: Unbiased Die Characteristics Die Dimensions 2616µm x 2794µm (103 mils x 110 mils) Thickness: 483µm ±25µm (19 mils ±1 mil) Interface Materials GLASSIVATION Type: PSG Thickness: 8kÅ ± 1kÅ TOP METALLIZATION Type: Al/Cu/Si (98.75%/0.5%/0.75%) Thickness: 16kÅ BACKSIDE FINISH Gold Assembly Related Information SUBSTRATE POTENTIAL Unbiased (DI) Additional Information WORST CASE CURRENT DENSITY < 2 x 105 A/cm2 PROCESS Dielectrically Isolated RH - Si-GATE TRANSISTOR COUNT: 96 |
|
|
Link URL |
| Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link to Datasheet | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |