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TS4962M Datasheet(PDF) 38 Page - STMicroelectronics |
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TS4962M Datasheet(HTML) 38 Page - STMicroelectronics |
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38 / 41 page ![]() Package information TS4962M 38/41 DocID11703 Rev 7 Figure 74. 9-bump Flip Chip marking (top view) 1. Legend: ST logo E = symbol for lead-free First two “XX” = product code = 62 Third X = assembly code Three-digit date code, Y = year, WW = week Black dot is for marking pin A1 Figure 75. 9-bump Flip Chip recommended footprint XXX YWW E XXX YWW E Pad in Cu 18 µm with Flash NiAu (2-6µm, 0.2µm max.) 150 µm min. 500 µm 500 µm Φ=250µm Φ=400µm typ. 75µm min. 100 µm max. Track Non Solder mask opening Φ=340µm min. Pad in Cu 18 µm with Flash NiAu (2-6µm, 0.2µm max.) 150 µm min. 500 µm 500 µm Φ=250µm Φ=400µm typ. 75µm min. 100 µm max. Track Non Solder mask opening Φ=340µm min. |
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