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MB97R8050 Datasheet(PDF) 8 Page - RAMXEED LIMITED |
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MB97R8050 Datasheet(HTML) 8 Page - RAMXEED LIMITED |
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8 / 13 page ![]() MB97R8050 8 DS411-00005-4v0-E ELECTRICAL CHARACTERISTICS 1. Absolute Maximum Rating * ESD measurement condition: The die chip has been mounted into a QFN40 package. WARNING: Semiconductor devices may be permanently damaged by application of stress (including, without limitation, voltage, current or temperature) in excess of absolute maximum ratings. Do not exceed any of these ratings. 2. Recommended Operation Conditions WARNING: The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of the device's electrical characteristics are warranted when the device is operated under these conditions. Any use of semiconductor devices will be under their recommended operating condition. Operation under any conditions other than these conditions may adversely affect reliability of device and could result in device failure. No warranty is made with respect to any use, operating conditions or combinations not represented on this data sheet. If you are considering application under any conditions other than listed herein, please contact sales representatives beforehand. Parameter Symbol Rating Unit Remarks Min Typ Max Maximum input voltage VMAX 3.0 V Between PWRP-PWRM ESD voltage immunity* VESD 2 2 kV Human Body Model 100 100 V Machine Model 750 750 V Charged Device Model Storage temperature TSTG 40 85 C Excluding FeRAM data retention guarantee Parameter Symbol Value Unit Remarks Min Typ Max Operation ambient tem- perature Ta -40 +55 C Retention guarantee temperature Trtn1 -40 +55 C Retention guarantee period: 10years Antenna input frequency Fclk 860 960 MHz According to the Radio Law Reception modulation depth (A-B)/A 80 90 100 % Data 0 symbol duration Tari 6.25 25 s Receiving waveform rise time Tr 1 500 s Receiving waveform settling time Ts 1500 s Receiving waveform fall time Tf 1 500 s |
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