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DS250DF230ZLSR Datasheet(PDF) 95 Page - Texas Instruments

Part # DS250DF230ZLSR
Description  DS250DF230 25-Gbps Multi-Rate 2-Channel Retimer
PDF  119 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

DS250DF230ZLSR Datasheet(HTML) 95 Page - Texas Instruments

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9.2.1.1 Design Requirements
For this design example, the following guidelines outlined in Table 9-1 apply.
Table 9-1. Front-Port Application Design Guidelines
DESIGN PARAMETER
REQUIREMENT
AC-coupling capacitors
Egress (ASIC-to-module) direction: AC-coupling capacitors in the
range of 100 to 220 nF are required for the RX inputs and are NOT
required for the TX outputs.
Ingress (module-to-ASIC) direction: AC-coupling capacitors in the
range of 100 to 220 nF are required for the TX outputs and are NOT
required for the RX inputs.
Input channel insertion loss
≤ 35 dB at 25.78125-Gbps Nyquist frequency (12.9 GHz)
Output channel insertion loss
Egress (ASIC-to-module) direction: Follow CAUI-4 / CEI-25G-VSR
host channel requirements (approximately 7 dB at 12.9 GHz).
Ingress (module-to-ASIC) direction: Depends on downstream ASIC /
FPGA capabilities. The DS250DF230 has a low-jitter output driver
with 3-tap FIR filter for equalizing a portion of the output channel.
Host ASIC TX launch amplitude
800 mVppd to 1200 mVppd.
Host ASIC TX FIR filter
Depends on channel loss. Refer to the Setting the Output VOD, Pre-
Cursor, and Post-Cursor Equalization section.
9.2.1.2 Detailed Design Procedure
The design procedure for front-port applications is as follows:
1. Determine the total number of channels on the board which require a DS250DF230 for signal conditioning.
This will dictate the total number of DS250DF230 devices required for the board. It is generally
recommended that channels connected to the same front-port cage be grouped together in the same
DS250DF230 device. This will simplify the device settings, as similar loss channels generally use similar
settings.
2. Determine the maximum current draw required for all DS250DF230 retimers. This may impact the selection
of the regulator for the 2.5-V supply rail. To calculate the maximum current draw, multiply the maximum
transient power supply current by the total number of DS250DF230 devices.
3. Determine the maximum operational power consumption for the purpose of thermal analysis. There are two
ways to approach this calculation:
a. Maximum mission-mode operational power consumption is when all channels are locked and re-
transmitting the data which is received. PRBS pattern checkers/generators are not used in this mode
because normal traffic cannot be checked with a PRBS checker. For this calculation, multiply the
worst-case power consumption in mission mode by the total number of DS250DF230 devices.
b. Maximum debug-mode operational power consumption is when all channels are locked and re-
transmitting the data which is received. At the same time, some channels’ PRBS checkers or generators
may be enabled. For this calculation, multiply the worst-case power consumption in debug mode by the
total number of DS250DF230 devices.
4. Determine the SMBus address scheme needed to uniquely address each DS250DF230 device on the board,
depending on the total number of devices identified in step 2. Each DS250DF230 can be strapped with one
of 16 unique SMBus addresses. If there are more DS250DF230 devices on the board than the number of
unique SMBus addresses which can be assigned, then use an I2C expander like the TCA/PCA family of
I2C/SMBus switches and multiplexers to split up the SMBus into multiple busses.
5. Determine if the device will be configured from EEPROM (SMBus Master Mode) or from the system I2C bus
(SMBus Slave Mode).
a. If SMBus Master Mode will be used, provisions must be made for an EEPROM on the board with 8-bit
SMBus address 0xA0. Refer to SMBus Master Mode for more details on SMBus Master Mode including
EEPROM size requirements.
b. If SMBus Slave Mode will be used for all device configurations, an EEPROM is not needed.
6. Make provisions in the schematic and layout for standard decoupling capacitors between the device VDD
supply and GND. Refer to the pin function description in Pin Configuration and Functions for more details.
www.ti.com
DS250DF230
SNLS590C – AUGUST 2018 – REVISED JUNE 2021
Copyright © 2021 Texas Instruments Incorporated
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Product Folder Links: DS250DF230



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