LMC6484AIMXSLASHNOPB.B datasheet(5/50 Pages) TI2

5 / 50 page

5.4 Thermal Information LMC6482

THERMAL METRIC(1)

LMC6482

UNIT

D (SOIC)

DGK (VSSOP)

P (PDIP)

8 PINS

RθJA

Junction-to-ambient thermal resistance

128.9

169.5

76.2

ºC/W

RθJC(top)

Junction-to-case(top) thermal resistance

68.6

60.9

65.6

ºC/W

RθJB

Junction-to-board thermal resistance

72.4

91.2

52.7

ºC/W

ψJT

Junction-to-top characterization parameter

19.7

8.3

35.3

ºC/W

ψJB

Junction-to-board characterization parameter

71.6

89.6

52.2

ºC/W

RθJC(bot)

Junction-to-case(bottom) thermal resistance

N/A

ºC/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

5.5 Thermal Information LMC6484

THERMAL METRIC(1)

LMC6484

UNIT

D (SOIC)

N (PDIP)

14 PINS

RθJA

Junction-to-ambient thermal resistance

83.0

53.6

ºC/W

RθJC(top)

Junction-to-case(top) thermal resistance

42.7

32.0

ºC/W

RθJB

Junction-to-board thermal resistance

42.4

26.0

ºC/W

ψJT

Junction-to-top characterization parameter

7.0

10.0

ºC/W

ψJB

Junction-to-board characterization parameter

42.0

25.5

ºC/W

RθJC(bot)

Junction-to-case(bottom) thermal resistance

N/A

ºC/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

www.ti.com

LMC6482

LMC6484

SNOS674J – OCTOBER 1997 – REVISED SEPTEMBER 2024

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LMC6484AIMX/NOPB.B Datasheet(PDF) 5 Page - Texas Instruments

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