SN75DP130

SLLSE57E – APRIL 2011 – REVISED MARCH 2015

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Table of Contents

9.2

Functional Block Diagram ....................................... 17

1

Features .................................................................. 1

9.3

Feature Description................................................. 18

2

Applications ........................................................... 1

9.4

Device Functional Modes........................................ 23

3

Description ............................................................. 1

9.5

Programming .......................................................... 25

4

Revision History..................................................... 2

9.6

Register Maps ........................................................ 26

5

Description (continued)......................................... 4

10

Application and Implementation........................ 33

6

Pin Configuration and Functions ......................... 4

10.1

Application Information.......................................... 33

7

Specifications......................................................... 6

10.2

Typical Application ............................................... 35

7.1

Absolute Maximum Ratings ...................................... 6

11

Power Supply Recommendations ..................... 38

7.2

ESD Ratings.............................................................. 6

11.1

SN75DP130 Power Sequencing ........................... 38

7.3

Recommended Operating Conditions ....................... 7

12

Layout................................................................... 41

7.4

Thermal Information .................................................. 8

12.1

Layout Guidelines ................................................. 41

7.5

Power Dissipation ..................................................... 8

12.2

Layout Example .................................................... 42

7.6

Electrical Characteristics .......................................... 9

13

Device and Documentation Support ................. 43

7.7

Switching Characteristics ........................................ 11

13.1

Trademarks ........................................................... 43

7.8

Typical Characteristics ............................................ 13

13.2

Electrostatic Discharge Caution ............................ 43

8

Parameter Measurement Information ................ 15

13.3

Glossary ................................................................ 43

9

Detailed Description ............................................ 17

14

Mechanical, Packaging, and Orderable

9.1

Overview ................................................................. 17

Information ........................................................... 43

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision D (July 2013) to Revision E

Page

•

Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional

Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device

and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1

Changes from Revision C (January 2013) to Revision D

Page

•

Power-Down Sequence deleted: 1. De-assert EN to the device.......................................................................................... 38

•

Power-Up Sequence deleted: 1. Assert RSTN and de-assert EN to the device.................................................................. 38

•

Power-Up Sequence deleted: 5. Assert EN a minimum of 10 µs after RSTN has been de-asserted. ............................... 38

•

Deleted the EN time line from Figure 34 .............................................................................................................................. 38

Changes from Revision B (October 2011) to Revision C

Page

•

Added text to RSTN description in PIN FUNCTIONS ............................................................................................................ 5

•

Added RSTN pin row to VIH in RECOMMENDED OPERATING CONDITIONS .................................................................... 7

•

Added RSTN pin row to VIL in RECOMMENDED OPERATING CONDITIONS .................................................................... 7

•

Added rows to Device power under normal operation in POWER DISSIPATION table ........................................................ 8

•

Changed in Table 1 13.9 to 113.9 ........................................................................................................................................ 13

•

Deleted unnecessary tie dot in Block Diagram..................................................................................................................... 17

•

Changed Table 3 .................................................................................................................................................................. 20

•

Changed Figure 17 ............................................................................................................................................................... 21

•

Changed Figure 18 ............................................................................................................................................................... 23

•

Changed SN75DP130 Local I

2C Control and Status Registers ........................................................................................... 26

•

Added DP130 POWER SEQUENCING section ................................................................................................................... 38

2

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