STPS30170C

Characteristics

DocID11640 Rev 2

5/13

0

10

20

30

40

50

60

70

80

0

5

10

15

20

25

30

35

40

SCu(cm²)

Rth(j-a) (°C/W)

Epoxy printed board FR4, eCU= 35 µm

Figure 7: Forward voltage drop versus forward

current (per diode, low level)

Figure 8: Forward voltage drop versus forward

current (per diode, high level)

Figure 9: Thermal resistance junction to ambient versus copper surface under tab for

D²PAK (typical values)

IF (A)

0.0

2.5

5.0

7.5

10.0

12.5

15.0

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

Tj=25°C

(Maximum values)

Tj=125°C

(Maximum values)

Tj=125°C

(Maximum values)

Tj=125°C

(Typical values)

Tj=125°C

(Typical values)

VF (V)

IF (A)

1

10

100

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

Tj=25°C

(Maximum values)

Tj=125°C

(Maximum values)

Tj=125°C

(Maximum values)

Tj=125°C

(Typical values)

Tj=125°C

(Typical values)

VF (V)