TPD1E6B06

SLLSEB2E – FEBRUARY 2012 – REVISED OCTOBER 2015

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6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Operating free-air temperature, TA

–40

125

°C

Operating Voltage

Pin 1 to 2 or Pin 2 to 1

–5

5

V

6.4 Thermal Information

TPD1E6B06

THERMAL METRIC(1)

DPL (X2SON)

UNIT

2 PINS

RθJA

Junction-to-ambient thermal resistance

567.1

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

253.2

°C/W

RθJB

Junction-to-board thermal resistance

31.6

°C/W

ψJT

Junction-to-top characterization parameter

379.1

°C/W

ψJB

Junction-to-board characterization parameter

31.6

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

VRWM

Reverse stand-off voltage

ILEAK = 100 nA

±5

V

ILEAK

Leakage current

Pin 1 = 5 V, Pin 2 = 0 V

100

nA

IPP = 1 A, tp = 8/20 μs

10

Clamp voltage with ESD strike on pin 1, pin 2

VClamp1,2

V

grounded.

IPP = 5 A, tp = 8/20 μs

14

IPP = 1 A, tp = 8/20 μs

10

Clamp voltage with ESD strike on pin 2, pin 1

VClamp2,1

V

grounded.

IPP = 5 A, tp = 8/20 μs

14

Pin 1 to Pin 2(1)

0.55

RDYN

Dynamic resistance

Ω

Pin 2 to Pin 1(1)

0.55

CIO

I/O capacitance

VIO = 2.5 V; ƒ = 1 MHz

6

pF

VBR1,2

Breakdown voltage, pin 1 to pin 2

IIO = 1 mA

6

V

VBR2,1

Breakdown voltage, pin 2 to pin 1

IIO = 1 mA

6

V

(1)

Extraction of RDYN using least squares fit of TLP characteristics between IPP = 10 A and IPP = 20 A.

4

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