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25CS160-E/ST Datasheet(PDF) 44 Page - Microchip Technology |
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25CS160-E/ST Datasheet(HTML) 44 Page - Microchip Technology |
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44 / 53 page ![]() 2026 Microchip Technology Inc. and its subsidiaries Preliminary DS20007008B-page 44 25CS160 RECOMMENDED LAND PATTERN Microchip Technology Drawing No. C04-2028-C8X Rev.F 6-Lead Plastic Small Outline Transistor (C8X) [SOT-23] For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: 1. Dimensioning and tolerancing per ASME Y14.5M Dimension Limits Contact Pad Length (X6) Overall Width Distance Between Pads Contact Pad Width (X6) Contact Pitch Contact Pad Spacing 3.90 1.10 G Z Y 1.70 0.60 MAX MIN C X E Units NOM 0.95 BSC 2.80 MILLIMETERS Distance Between Pads GX 0.35 E X GX Y G C Z SILK SCREEN |
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