LIS3LV02DL datasheet(13/48 Pages) STMICROELECTRONICS

13 / 48 page

LIS3LV02DL

Mechanical and electrical specifications

13/48

Non linearity

Best fit straight line

X, Y axis

Full-scale = ±2g

ODR=40Hz

±2

%FS

Best fit straight line

Z axis

Full-scale = ±2g

ODR=40Hz

±3

CrAx

Cross axis

-3.5

3.5

Vst

Self test output change(7),(8)

Full-scale= ±2g

X axis

100

240

400

LSb

Full-scale= ±2g

Y axis

100

240

400

LSb

Full-scale= ±2g

Z axis

-30

-150

-350

LSb

Full-scale= ±6g

X axis

130

LSb

Full-scale= ±6g

Y axis

130

LSb

Full-scale= ±6g

Z axis

-10

-50

-120

LSb

System bandwidth(9)

ODRx/4

Top

Operating temperature range

-40

+85

°C

Product weight

mgram

The product is factory calibrated at 3.3 V. The device can be used from 2.16 V to 3.6 V

Typical specifications are not guaranteed

Verified by wafer level test and specification of initial offset and sensitivity

Zero-g level offset value after MSL3 preconditioning

Offset can be eliminated by enabling the built-in high pass filter (HPF)

Results of accelerated reliability tests

Self Test output changes with the power supply. “Self test output change” is defined as OUTPUT[LSb](Self-test bit on

ctrl_reg1=1) - OUTPUT[LSb](Self-test bit on ctrl_reg1=0). 1LSb=1g/1024 at 12bit representation, 2g Full-Scale

Output data reach 99% of final value after 5/ODR when enabling Self-Test mode due to device filtering

ODRx is output data rate. Refer to Table 5 for specifications

Table 4.

Mechanical characteristics @ Vdd=2.5 V, T=25 °C unless otherwise noted(1)

(continued)

Symbol

Parameter

Test conditions

Min.

Typ.(2)

Max.

Unit

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