■ Specifications and Test Methods

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Post-treatment

Non treatment:Let sit for 24+/-2hours at room temperature, then measure.

Moisture Resistance

Appearance

No defects or abnormalities.

Mounting method

Solder the capacitor on the test substrate

Capacitance Change

Within +/-12.5%

Test Time

Apply the 24h treatment shown below, 10 consecutive times.

Q or D.F.

DF≦0.02

Temperature and Humidity cycle

I.R.(Room Temp.)

Within the specified initial value.

Destructive Physical

Analysis

Appearance

No defects or abnormalities.

Per EIA-469

Post-treatment

Non treatment:Let sit for 24+/-2hours at room temperature, then measure.

Temperature Cycling

Appearance

No defects or abnormalities.

Mounting method

Reflow solder the capacitor on the test substrate

Capacitance Change

Within +/-7.5%

Pre-treatment

Heat treatment:Perform a heat treatment at 150+0/-10°C for 1hour and then let sit for 24+/-2hours

Q or D.F.

Within the specified initial value.

at room temperature, then measure.

I.R.(Room Temp.)

Within the specified initial value.

Cycles

1000cycles

Temperature Cycling

Pre-and Post-Stress

Electrical Test

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High Temperature

Exposure (Storage)

Appearance

No defects or abnormalities.

Mounting method

Solder the capacitor on the test substrate

Capacitance Change

Within +/-10%

Test Temperature

150+/-3℃

Q or D.F.

DF≦0.02

Test Time

1000+/-12h

I.R.(Room Temp.)

Within the specified initial value.

Post-treatment

Non treatment:Let sit for 24+/-2hours at room temperature, then measure.

No

Item

Specification

Test Method（Compliant Standard:AEC-Q200）

AEC-Q200 Rev.

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Rev.D

GC331CD7LP683KX19-00B

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