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MPC8349E Datasheet(PDF) 21 Page - Freescale Semiconductor, Inc

Part # MPC8349E
Description  PowerQUICC??II Pro Integrated Host Processor Hardware Specifications
PDF  88 Pages
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Manufacturer  FREESCALE [Freescale Semiconductor, Inc]
Direct Link  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MPC8349E Datasheet(HTML) 21 Page - Freescale Semiconductor, Inc

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MPC8349E PowerQUICC™ II Pro Integrated Host Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
21
Ethernet: Three-Speed Ethernet, MII Management
8
Ethernet: Three-Speed Ethernet, MII Management
This section provides the AC and DC electrical characteristics for three-speeds (10/100/1000 Mbps) and
MII management.
8.1
Three-Speed Ethernet Controller (TSEC)—
GMII/MII/TBI/RGMII/RTBI Electrical Characteristics
The electrical characteristics specified here apply to the gigabit media independent interface (GMII), the
media independent interface (MII), ten-bit interface (TBI), reduced gigabit media independent
interface (RGMII), and reduced ten-bit interface (RTBI) signals except management data input/output
(MDIO) and management data clock (MDC). The MII, GMII, and TBI interfaces are defined for 3.3 V,
and the RGMII and RTBI interfaces can operate at 3.3 or 2.5 V. The RGMII and RTBI interfaces follow
the Hewlett-Packard Reduced Pin-Count Interface for Gigabit Ethernet Physical Layer Device
Specification, Version 1.2a (9/22/2000). The electrical characteristics for MDIO and MDC are specified
in Section 8.3, “Ethernet Management Interface Electrical Characteristics.”
8.1.1
TSEC DC Electrical Characteristics
All GMII, MII, TBI, RGMII, and RTBI drivers and receivers comply with the DC parametric attributes
specified in Table 19 and Table 20. The potential applied to the input of a GMII, MII, TBI, RGMII, or
RTBI receiver may exceed the potential of the receiver power supply (that is, a RGMII driver powered
from a 3.6-V supply driving VOH into a RGMII receiver powered from a 2.5-V supply). Tolerance for
dissimilar RGMII driver and receiver supply potentials is implicit in these specifications. The RGMII and
RTBI signals are based on a 2.5-V CMOS interface voltage as defined by JEDEC EIA/JESD8-5.
Table 19. GMII/TBI and MII DC Electrical Characteristics
Parameter
Symbol
Conditions
Min
Max
Unit
Supply voltage 3.3 V
LVDD
2
—
2.97
3.63
V
Output high voltage
VOH
IOH = –4.0 mA
LVDD = Min
2.40
LVDD +0.3
V
Output low voltage
VOL
IOL = 4.0 mA
LVDD = Min
GND
0.50
V
Input high voltage
VIH
——
2.0
LVDD +0.3
V
Input low voltage
VIL
—
—
–0.3
0.90
V
Input high current
IIH
VIN
1 = LV
DD
—40
μA
Input low current
IIL
VIN
1 = GND
–600
—
μA
Notes:
1. The symbol VIN, in this case, represents the LVIN symbol referenced in Table 1 and Table 2.
2. GMII/MII pins not needed for RGMII or RTBI operation are powered by the OVDD supply.



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