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MPC8349E Datasheet(PDF) 21 Page - Freescale Semiconductor, Inc |
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MPC8349E Datasheet(HTML) 21 Page - Freescale Semiconductor, Inc |
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21 / 88 page ![]() MPC8349E PowerQUICC™ II Pro Integrated Host Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 21 Ethernet: Three-Speed Ethernet, MII Management 8 Ethernet: Three-Speed Ethernet, MII Management This section provides the AC and DC electrical characteristics for three-speeds (10/100/1000 Mbps) and MII management. 8.1 Three-Speed Ethernet Controller (TSEC)— GMII/MII/TBI/RGMII/RTBI Electrical Characteristics The electrical characteristics specified here apply to the gigabit media independent interface (GMII), the media independent interface (MII), ten-bit interface (TBI), reduced gigabit media independent interface (RGMII), and reduced ten-bit interface (RTBI) signals except management data input/output (MDIO) and management data clock (MDC). The MII, GMII, and TBI interfaces are defined for 3.3 V, and the RGMII and RTBI interfaces can operate at 3.3 or 2.5 V. The RGMII and RTBI interfaces follow the Hewlett-Packard Reduced Pin-Count Interface for Gigabit Ethernet Physical Layer Device Specification, Version 1.2a (9/22/2000). The electrical characteristics for MDIO and MDC are specified in Section 8.3, “Ethernet Management Interface Electrical Characteristics.” 8.1.1 TSEC DC Electrical Characteristics All GMII, MII, TBI, RGMII, and RTBI drivers and receivers comply with the DC parametric attributes specified in Table 19 and Table 20. The potential applied to the input of a GMII, MII, TBI, RGMII, or RTBI receiver may exceed the potential of the receiver power supply (that is, a RGMII driver powered from a 3.6-V supply driving VOH into a RGMII receiver powered from a 2.5-V supply). Tolerance for dissimilar RGMII driver and receiver supply potentials is implicit in these specifications. The RGMII and RTBI signals are based on a 2.5-V CMOS interface voltage as defined by JEDEC EIA/JESD8-5. Table 19. GMII/TBI and MII DC Electrical Characteristics Parameter Symbol Conditions Min Max Unit Supply voltage 3.3 V LVDD 2 — 2.97 3.63 V Output high voltage VOH IOH = –4.0 mA LVDD = Min 2.40 LVDD +0.3 V Output low voltage VOL IOL = 4.0 mA LVDD = Min GND 0.50 V Input high voltage VIH —— 2.0 LVDD +0.3 V Input low voltage VIL — — –0.3 0.90 V Input high current IIH VIN 1 = LV DD —40 μA Input low current IIL VIN 1 = GND –600 — μA Notes: 1. The symbol VIN, in this case, represents the LVIN symbol referenced in Table 1 and Table 2. 2. GMII/MII pins not needed for RGMII or RTBI operation are powered by the OVDD supply. |
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