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TSZ02201-0G1G1A600030-1-2

© 2017 ROHM Co., Ltd. All rights reserved.

www.rohm.com

BD80C0AFPS-C

TSZ22111 • 15 • 001

22.Dec.2017 Rev.001

Absolute Maximum Ratings

Parameter

Symbol

Ratings

Unit

Supply Voltage(Note 1)

VCC

-

0.3 to +35.0

V

Output Voltage

VO

-

0.3 to +16.0

V

Operating Ambient Temperature Range

Ta

-

40 to +125

°C

Storage Temperature Range

Tstg

-

55 to +150

°C

Maximum Junction Temperature

Tjmax

+150

°C

Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is

operated over the absolute maximum ratings.

Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the

properties of the chip. In case of exceeding this absolute maximum rating, design a PCB boards with thermal resistance and power dissipation taken

into consideration by increasing board size and copper area so as not to exceed the maximum junction temperature rating.

(Note 1) Do not exceed Tjmax.

Thermal Resistance(Note 1)

Parameter

Symbol

Thermal Resistance(Typ)

Unit

1s(Note 3)

2s2p(Note 4)

TO252S-3

Junction to Ambient

θJA

155.4

24.3

°C/W

Junction to Top Characterization Parameter(Note 2)

ΨJT

8

3

°C/W

(Note 1) Based on JESD51-2A(Still-Air)

(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface

of the component package.

(Note 3) Using a PCB board based on JESD51-3.

Layer Number of

Measurement Board

Material

Board Size

Single

FR-4

114.3mm x 76.2mm x 1.57mmt

Top

Copper Pattern

Thickness

Footprints and Traces

70μm

(Note 4) Using a PCB board based on JESD51-5, 7.

Layer Number of

Measurement Board

Material

Board Size

Thermal Via(Note 5)

Pitch

Diameter

4 Layers

FR-4

114.3mm x 76.2mm x 1.6mmt

1.20mm

Φ0.30mm

Top

2 Internal Layers

Bottom

Copper Pattern

Thickness

Copper Pattern

Thickness

Copper Pattern

Thickness

Footprints and Traces

70μm

74.2mm x 74.2mm

35μm

74.2mm x 74.2mm

70μm

(Note 5) This thermal via connects with the copper pattern of all layers.