ADV7181CBSTZ datasheet(9/20 Pages) AD

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Data Sheet

ADV7181C

Rev. E | Page 9 of 20

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

Rating

AVDD to AGND

4 V

DVDD to DGND

2.2 V

PVDD to AGND

2.2 V

DVDDIO to DGND

4 V

DVDDIO to AVDD

−0.3 V to +0.3 V

PVDD to DVDD

−0.3 V to +0.3 V

DVDDIO to PVDD

−0.3 V to +2 V

DVDDIO to DVDD

−0.3 V to +2 V

AVDD to PVDD

−0.3 V to +2 V

AVDD to DVDD

−0.3 V to +2 V

Digital Inputs Voltage to DGND

DGND − 0.3 V to

DVDDIO + 0.3 V

Digital Outputs Voltage to DGND

DGND − 0.3 V to

DVDDIO + 0.3 V

Analog Inputs to AGND

AGND − 0.3 V to

AVDD + 0.3 V

Operating Temperature Range

−40°C to +85°C

Maximum Junction Temperature (T

J MAX)

125°C

Storage Temperature Range

−65°C to +150°C

Infrared Reflow, Soldering (20 sec)

260°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

PACKAGE THERMAL PERFORMANCE

To reduce power consumption when using the part, turn off any

unused ADCs.

It is imperative that the recommended scripts be used for the

following high current modes: SCART, 720p, 1080i, and all

RGB graphic standards. Using the recommended scripts ensures

correct thermal performance. These scripts are available from

a local FAE.

The junction temperature must always stay below the maximum

junction temperature (TJ MAX) of 125°C. The junction temperature

can be calculated by

TJ = TA MAX + (θJA × WMAX)

where:

TA MAX = 85°C.

θJA = 45.5°C/W.

WMAX = ((AVDD × IAVDD) + (DVDD × IDVDD) +

(DVDDIO × IDVDDIO) + (PVDD × IPVDD)).

THERMAL SPECIFICATIONS

Table 6.

Parameter

Test Conditions

Value

Junction-to-Case

Thermal Resistance, θ

4-layer PCB with solid

ground plane

9.2°C/W

typical

Junction-to-Ambient

Thermal Resistance, θ

4-layer PCB with solid

ground plane (still air)

45.5°C/W

typical

ESD CAUTION

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