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PCF2131 Datasheet(PDF) 27 Page - NXP Semiconductors |
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PCF2131 Datasheet(HTML) 27 Page - NXP Semiconductors |
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27 / 34 page ![]() NXP Semiconductors UM12262 FRDM-IMX91 Board User Manual MX93AUD-HAT 8MIC-RPI-MX8 Figure 13. Accessory boards 3.2.1 Software configuration update • To use the MX93AUD-HAT and 8MIC-RPI-MX8 boards together or use the MX93AUD-HAT board alone, run the following commands at U-Boot to replace the default dtb: $setenv fdtfile imx91-11x11-frdm-aud-hat.dtb $saveenv $boot • To use the 8MIC-RPI-MX8 board alone, run the following commands at U-Boot to replace the default dtb: $setenv fdtfile imx91-11x11-frdm-8mic.dtb $saveenv $boot 4 PCB information The FRDM-IMX91 is made with standard 10-layer technology. The material is FR-4, and the PCB stack-up information is described in Table 22. Layer Description Copper (mil) Generic Er Dielectric thickness (mil) 1 TOP 0.7+Plating - - 1.3 - Dielectric - 2.61 2 GND02 1.4 - - - - Dielectric - 3 3 ART03 1.4 - - - - Dielectric - 8.8 4 PWR04 1.4 - - - - Dielectric - 4 5 PWR05 1.4 - - - Table 22. FRDM-IMX91 board stack up information UM12262 All information provided in this document is subject to legal disclaimers. © 2025 NXP B.V. All rights reserved. User manual Rev. 3.0 — 22 April 2025 Document feedback 27 / 34 |
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