NXP Semiconductors

UM12262

FRDM-IMX91 Board User Manual

Layer

Description

Copper (mil)

Generic

Er

Dielectric thickness (mil)

-

Dielectric

-

8.8

6

ART06

1.4

-

-

-

-

Dielectric

-

4

7

GND07

1.4

-

-

-

-

Dielectric

-

8.8

8

ART08

1.4

-

-

-

-

Dielectric

-

3

9

GND09

1.4

-

-

-

-

Dielectric

-

2.61

10

BOTTOM

0.7+Plating

-

-

1.3

Finished: 1.6 mm

Designed: 71.304 mil

1.811 mm

Material: FR-4

Table 22. FRDM-IMX91 board stack up information...continued

5 European Union regulatory compliance

Table 23 is provided as per Article 10.8 of the Radio Equipment Directive 2014/53/EU.

(a) Frequency bands in which the equipment operates.

(b) The maximum RF power transmitted.

Part number

RF technology

(a) Frequency range

(b) Maximum transmitted

power

Bluetooth Low Energy 5.4

2402 MHz - 2480 MHz

13 dBm

IEEE 802.15.4

2405 MHz - 2480 MHz

13 dBm

Wi-Fi IEEE 802.11b/g/n/ax

2400 MHz - 2500 MHz

16 dBm

FRDM-IMX91

Wi-Fi IEEE 802.11a/n/ac/ax

4900 MHz - 5895 MHz

18 dBm

Table 23. EU regulatory compliance

EUROPEAN DECLARATION OF CONFORMITY (Simplified DoC per Article 10.9 of the Radio Equipment

Directive 2014/53/EU)

This apparatus, namely FRDM-IMX91 Freedom Development Platform, conforms to the Radio Equipment

Directive 2014/53/EU. The full EU Declaration of Conformity for this apparatus can be found at the NXP

website: FRDM-IMX91.

6 Acronyms

Table 24 lists and explains the acronyms and abbreviations used in this document.

Term

Description

BGA

Ball grid array

Table 24. Acronyms

UM12262

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User manual

Rev. 3.0 — 22 April 2025

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