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EMLS232UA Datasheet(PDF) 3 Page - Emerging Memory & Logic Solutions Inc |
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EMLS232UA Datasheet(HTML) 3 Page - Emerging Memory & Logic Solutions Inc |
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3 / 14 page ![]() EMLS232UA Series 512K x 32 x 4Banks Low Power SDRAM Rev 0.6 General Wafer Specifications Process Technology : 0.125um Trench DRAM Process Wafer thickness : 725 +/- 25um Typical Pad Open Size : 70.2um x 70.2um Minimum Pad Pitch : 93.6um Wafer Diameter : 8-inch |
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