Ref.: Dwg. No. 1018019 rev. D

PACKAGE MECHANICAL DATA

Inform ati on furni shed is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibili ty for

the consequences of use of such information nor for any infringement of patents or other rights of thir d parties w hic h may result from

its use. No lic ense is granted by impli cation or otherwise under any patent or patent rights of SGS-THOMSON Mi croele ctr oni cs.

Specificati ons mentioned i n this publication are subj ect to change without notice. T hi s publication supersedes and repl aces all

information pr evio usly supplied. SGS-T HOMSON Mi croelectronics products are not authorized for use as critical components in life

support devices or systems without express written approval of SGS-THOMSON Mi croelectronics.

©1996 SGS-THOMSON Microelectronics - All Rights Reserved

SGS-THOMSON Microelectronics GROUP O F COMPANIES

Australia - B razi l - France - Germany - Hong Kong - Ital y - Japan - Korea - Malaysia -

Mal ta - Mor occo - The Netherlands - S ingapore - Spain - Sweden - Switzerland - Taiw an -

T hai land - Uni ted Kingdom - U.S.A.

STM1645-10

5/5