The Rth j-amb of the TDA3190 can be reduced by

soldering the GND pins to a suitable copper area

of the printed circuit board (fig. 18) or to an external

heatsink (fig. 19).

The diagram of figure 20 shows the maximum

dissipable power Ptot and the Rth j-amb as a func-

tion of the side ”l” of two equal square copper areas

having a thickness of 35

µ (1.4 mils).

During soldering the pins temperature must not

exceed 260

°C and the soldering time must not be

longer than 12 seconds.

The external heatsink or printed circuit copper area

must be connected to electrical ground.

MOUNTING INSTRUCTION

Figure 18 : Example of P.C. Board Copper Area

which is used as Heatsink

Figure 19 : External Heatsink Mounting Example

Figure 20 : Maximum Dissipable Power and Junc-

tion to Ambient Thermal Resistance

versus Side ”T”

Figure 21 : Maximum Allowable Power Dissipa-

tion versus Ambient Temperature

TDA3190

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