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VSKTF18012HKP Datasheet(PDF) 3 Page - Vishay Siliconix |
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VSKTF18012HKP Datasheet(HTML) 3 Page - Vishay Siliconix |
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3 / 9 page ![]() Document Number: 93685 For technical questions, contact: ind-modules@vishay.com www.vishay.com Revision: 22-Apr-08 3 VSK.F180..P Series Fast Thyristor/Diode and Thyristor/Thyristor (MAGN-A-PAKTM Power Modules), 180 A Vishay High Power Products SWITCHING PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS KJ Maximum non-repetitive rate of rise dI/dt Gate drive 20 V, 20 Ω, t r ≤ 1 ms, VD = 80 % VDRM TJ = 25 °C 800 A/µs Maximum recovery time trr ITM = 350 A, dI/dt = - 25 A/µs, VR = 50 V, TJ = 25 °C 2 µs Maximum turn-off time tq ITM = 750 A; TJ = 125 °C; dI/dt = - 25 A/µs; VR = 50 V; dV/dt = 400 V/µs linear to 80 % VDRM 20 25 BLOCKING PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS Maximum critical rate of rise of off-state voltage dV/dt TJ = 125 °C, exponential to 67 % VDRM 1000 V/µs RMS insulation voltage VINS 50 Hz, circuit to base, all terminals shorted, 25 °C, 1 s 3000 V Maximum peak reverse and off-state leakage current IRRM, IDRM TJ = 125 °C, rated VDRM/VRRM applied 50 mA TRIGGERING PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS Maximum peak gate power PGM f = 50 Hz, d% = 50 60 W Maximum peak average gate power PG(AV) TJ = 125 °C, f = 50 Hz, d% = 50 10 Maximum peak positive gate current IGM TJ = 125 °C, tp ≤ 5 ms 10 A Maximum peak negative gate voltage - VGM 5V Maximum DC gate current required to trigger IGT TJ = 25 °C, Vak 12 V, Ra = 6 200 mA DC gate voltage required to trigger VGT 3V DC gate current not to trigger IGD TJ = 125 °C, rated VDRM applied 20 mA DC gate voltage not to trigger VGD 0.25 V THERMAL AND MECHANICAL SPECIFICATIONS PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS Maximum junction operating temperature range TJ - 40 to 125 °C Maximum storage temperature range TStg - 40 to 150 Maximum thermal resistance, junction to case per junction RthJC DC operation 0.125 K/W Maximuml thermal resistance, case to heatsink per module RthCS Mounting surface, flat and greased 0.02 Mounting torque ± 10 % MAP to heatsink Amounting compound is recommended. The torque should be rechecked after a period of 3 hours to allow for the spread of the compound. Use of cable lugs is not recommended, busbar should be used and restrained during tightening. Threads must be lubricated with a compound. 4 to 6 (35 to 53) N · m (lbf · in) busbar to MAP Approximate weight 500 g 17.8 oz. |
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