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LTC1503-1.8/LTC1503-2

Figure 3. Output Ripple Reduction Techniques

VOUT

LTC1503-X

VOUT

µF

TANTALUM

0.5

Ω

µF

CERAMIC

VOUT

1503-1.8/2 F03

µF

TANTALUM

µF

TANTALUM

capacitor on VOUT to reduce both the low and high fre-

quency ripple. An RC filter may also be used to reduce high

frequency voltage spikes.

Protection Features

The LTC1503-X contains both thermal shutdown and

short-circuit protection features. The charge pump will

shut down when the junction temperature reaches ap-

proximately 150

°C and will resume operation once the

junction temperature has dropped back to 125

°C. The part

will limit output current to 20mA (typ) when a short-circuit

condition (VOUT < 150mV) exists to prevent damage to the

internal switches. During start-up, the 20mA current limit

is disabled once VOUT reaches 0.7V (typ). The part can

survive an indefinite short from VOUT to GND.

Layout Considerations

For best regulation and noise performance, careful board

layout is required. Improper bypassing and grounding

may lead to poor load regulation and output ripple perfor-

mance. All capacitors, especially CIN and COUT, must be as

close as possible to the VIN and VOUT pins. Connecting the

GND pin and all bypass capacitors to an uninterrupted

ground plane is also advised. See Figure 4 for recom-

mended component placement and grounding.

LTC1503-X

GND

VIN

CIN

COUT

1503-1.8/2 F04

SHDN/SS

VOUT

Figure 4. Recommended Component Placement and Grounding

APPLICATIO S I FOR ATIO

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