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LTM4614EVPBF Datasheet(PDF) 13 Page - Linear Technology |
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LTM4614EVPBF Datasheet(HTML) 13 Page - Linear Technology |
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13 / 20 page ![]() LTM4614 13 4614fa Figure 7. 1.2V No Heat Sink (VIN = 5V) Figure 8. 1.2V Heat Sink (VIN = 5V) APPLICATIONS INFORMATION Figure 9. 3.3V No Heat Sink (VIN = 5V) Figure 10. 3.3V Heat Sink (VIN = 5V) 4.5 2.0 3.0 3.5 4.0 2.5 1.0 1.5 0.5 0 4614 F07 110 50 60 70 80 90 120 100 40 AMBIENT TEMPERATURE (°C) 200LFM NO HEAT SINK 0LFM NO HEAT SINK 400LFM NO HEAT SINK 4.5 2.0 3.0 3.5 4.0 2.5 1.0 1.5 0.5 0 4614 F08 110 50 60 70 80 90 120 100 40 0LFM HEAT SINK 200LFM HEAT SINK 400LFM HEAT SINK AMBIENT TEMPERATURE (°C) 4.5 2.0 3.0 3.5 4.0 2.5 1.0 1.5 0.5 0 4614 F09 110 50 60 70 80 AMBIENT TEMPERATURE (°C) 90 120 100 40 0LFM NO HEAT SINK 200LFM NO HEAT SINK 400LFM NO HEAT SINK 4.5 2.0 3.0 3.5 4.0 2.5 1.0 1.5 0.5 0 4614 F10 110 50 60 70 80 90 120 100 40 AMBIENT TEMPERATURE (°C) 0LFM HEAT SINK 200LFM HEAT SINK 400LFM HEAT SINK module temperature rise can be allowed. As an example in Figure 7 the load current is de-rated to 3A for each chan- nel with 0LFM at ~ 90°C and the power loss for both channels at 5V to 1.2V at 3A output are ~1.5 watts. If the 90°C ambient temperature is subtracted from the 120°C maximum junction temperature, then the difference of 30°C divided 1.5W equals a 20°C/W thermal resistance. Table 2 specifies a 15°C/W value which is close. Table 2 and Table 3 provide equivalent thermal resistances for 1.2V and 3.3V outputs with and without air flow and heat sinking. The combine power loss for the two 4A outputs can be summed together and multiplied by the thermal resistance values in Tables 2 and 3 for module temperature rise under the specified conditions. The printed circuit board is a 1.6mm thick four layer board with 2 ounce copper for the two outer layers and 1 ounce copper for the two inner layers. The PCB dimensions are 95mm × 76mm. The data sheet list the θJP (junction to pin) and θJC (junction to case) thermal resistances under the Pin Configuration diagram. |
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