TO-264

N-Channel FREDFET

Absolute Maximum Ratings

Thermal and Mechanical Characteristics

G

D

S

Single die FREDFET

Unit

A

V

mJ

A

Unit

W

°C/W

°C

oz

g

in·lbf

N·m

Ratings

84

53

270

±30

1845

42

Min

Typ

Max

1135

0.11

0.11

-55

150

300

0.22

6.2

10

1.1

Parameter

Continuous Drain Current @ T

Continuous Drain Current @ T

Gate-Source Voltage

Avalanche Current, Repetitive or Non-Repetitive

Characteristic

Total Power Dissipation @ T

Junction to Case Thermal Resistance

Case to Sink Thermal Resistance, Flat, Greased Surface

Operating and Storage Junction Temperature Range

Soldering Temperature for 10 Seconds (1.6mm from case)

Package Weight

Mounting Torque ( TO-264 Package), 4-40 or M3 screw

Symbol

I

D

I

DM

V

GS

E

AS

I

AR

Symbol

P

D

R

θJC

R

θCS

T

T

L

W

T

Torque

TYPICAL APPLICATIONS

• ZVSphaseshiftedandotherfullbridge

•Halfbridge

•PFCandotherboostconverter

• Buckconverter

•Singleandtwoswitchforward

•Flyback

FEATURES

•FastswitchingwithlowEMI

•Lowtrrforhighreliability

•UltralowCrssforimprovednoiseimmunity

•Lowgatecharge

•Avalancheenergyrated

•RoHScompliant

APT84F50B2

APT84F50L

500V,84A,0.065

ΩMax,trr ≤320ns

APT84F50B2

APT84F50L

A proprietary planar stripe design yields excellent reliability and manufacturability. Low

tance. The intrinsic gate resistance and capacitance of the poly-silicon gate structure

help control slew rates during switching, resulting in low EMI and reliable paralleling,

even when switching at very high frequency. Reliability in flyback, boost, forward, and

other circuits is enhanced by the high avalanche energy capability.

MicrosemiWebsite-http://www.microsemi.com