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TMC1175A Datasheet(PDF) 13 Page - Cadeka Microcircuits LLC. |
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TMC1175A Datasheet(HTML) 13 Page - Cadeka Microcircuits LLC. |
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13 / 18 page  PRODUCT SPECIFICATION TMC1175A REV. 1.3.3 2/28/02 13 Figure 12. Typical Interface Circuit-High Performance +5V + - + - 0.1 µF 2V 0.1mF 0.1 µF VDDA VDDD VR+ RT RB VR- VIN AGND DGND OE CONV D7-0 TMC1175A 0.1 µF 0.1 µF 2k Ω 1k Ω LM385 1k Ω 1k Ω 75 Ω 455 Ω 455 Ω 20 Ω Video Input +5V Regulated +5V Gain Adjust +5V 27056A Wideband Op-amp Figure 13. Typical Interface Circuit – Low Cost Figure 14. Typical Interface Circuit – Stabilized Reference 0.1 µF 0.1 µF 0.1 µF 10 µF +5V 2.2k Ω 2k Ω 560 Ω 75 Ω Video Input 24458A Offset Adjust +5V 0.1 µF 0.1 µF VDDA VDDD VR+ RT RB VR- VIN AGND DGND OE CONV D7-0 TMC1175A 0.1 µF 10 µF 1k Ω 1k Ω 56 Ω RF Input 24457A +5V 0.1 µF 0.1 µF VDDA VDDD VR+ RT RB VR- VIN AGND DGND OE CONV D7-0 TMC1175A LM385 Grounding The TMC1175A has separate analog and digital circuits. To keep digital system noise from the A/D converter, it is recommended that power supply voltages (VDDD and VDDA) originate from separate sources with VDDA regulated, and that ground connections (DGND and AGND) be made to the analog ground plane. Power supply pins should be individually decoupled at the pin. The digital circuitry that gets its input from the TMC1175A should be referred to the system digital ground plane. Printed Circuit Board Layout Designing with high performance mixed-signal circuits demands printed circuits with ground planes. Wire-wrap is not an option, even for breadboarding. Overall system per- formance is strongly influenced by the board layout. Capac- itive coupling from digital to analog circuits may result in poor A/D conversion. Consider the following suggestions when doing the layout: 1. Keep the critical analog traces (VIN, RT, RB, VR+, VR-) as short as possible and as far as possible from all digital signals. The TMC1175A should be located near the board edge, close to the analog input connectors. 2. The power plane for the TMC1175A should be sepa- rate from that which supplies the rest of the digital cir- cuitry. A single power plane should be used for all of the VDD pins. If the power supply for the TMC1175A is the same as that of the system's digital circuitry, power to the TMC1175A should be decoupled with ferrite beads and 0.1µF capacitors to reduce noise. 3. The ground plane should be solid, not cross-hatched. Connections to the ground plane should have very short leads. |
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