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MB91F613 Datasheet(PDF) 22 Page - fujitsu semiconductor |
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MB91F613 Datasheet(HTML) 22 Page - fujitsu semiconductor |
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22 / 104 page ![]() MB91610 Series 22 DS07-16907-2E ■ PRECAUTIONS FOR HANDLING THE DEVICES Any semiconductor devices have inherently a certain rate of failure. The possibility of failure is greatly affected by the conditions in which they are used (circuit conditions, environmental conditions, etc.). This page describes precautions that must be observed to minimize the chance of failure and to obtain higher reliability from your FUJITSU MICROELECTRONICS semiconductor devices. 1. Precautions for Product Design This section describes precautions when designing electronic equipment using semiconductor devices. • Absolute Maximum Ratings Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings. • Recommended Operating Conditions The recommended operating conditions are required in order to ensure the normal operation of the semicon- ductor device. All of the device’s electrical characteristics are warranted when the device is operated within these ranges. Always use semiconductor devices within their recommended operating condition ranges. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their representatives beforehand. • Processing and Protection of Pins These precautions must be followed when handling the pins which connect semiconductor devices to power supply and input/output functions. (1) Preventing Over-Voltage and Over-Current Conditions Exposure to voltage or current levels in excess of maximum ratings at any pin is likely to cause deterioration within the device, and in extreme cases leads to permanent damage of the device. Try to prevent such overvoltage or over-current conditions at the design stage. (2) Protection of Output Pins Shorting of output pins to supply pins or other output pins, or connection to large capacitance can cause large current flows. Such conditions if present for extended periods of time can damage the device. Therefore, avoid this type of connection. (3) Handling of Unused Input Pins Unconnected input pins with very high impedance levels can adversely affect stability of operation. Such pins should be connected through an appropriate resistance to a power supply pin or ground pin. - PLL pin for OSD (recommended pin handling when PLL for OSD is not in use) Pin no. Pin name Recommended handling of unused pin 45 VSSP VSS (PLL macro GND) 46 VDDP VSS (PLL macro power supply) 47 VCI VSS 48 CPO VSS - Analog OSD (recommended pin handling when analog OSD is not in use) Pin no. Pin name Recommended handling of unused pin 49 VSSD VSS (DAC macro GND) |
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