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MB91F613 Datasheet(PDF) 27 Page - fujitsu semiconductor |
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MB91F613 Datasheet(HTML) 27 Page - fujitsu semiconductor |
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27 / 104 page ![]() MB91610 Series DS07-16907-2E 27 ■ HANDLING DEVICES • Power supply pins In products with multiple VCC and VSS pins, respective pins at the same potential are interconnected within the device in order to prevent malfunctions such as latch-up. However, all of these pins should be connected externally to the power supply or ground lines in order to reduce electromagnetic emission levels, to prevent abnormal operation of strobe signals caused by the rise in the ground level, and to conform to the total output current rating. Moreover, connect the current supply source with the VCC and VSS pins of this device at low impedance. It is also advisable that a ceramic capacitor of approximately 0.1 μF be connected as a bypass capacitor between VCC and VSS near this device. • Crystal oscillator circuit Noise near the X0 and X1 pins may cause the device to malfunction. Design the printed circuit board so that X0, X1, the crystal oscillator (or ceramic oscillator), and the bypass capacitor to ground are located as close to the device as possible. It is strongly recommended that the PC board artwork be designed such that the X0 and X1 pins are surrounded by ground plane as this is expected to produce stable operation. • OSDC output pin The OSDC output pins (R0 to R4, G0 to G5, B0 to B4, VOA0 to VOA2, VOB, DCKO) are high-speed corresponded output pin. Adjust the signal waveform such as by inserting damping resistor on the board as needed. • Using an external clock When using an external clock, the clock signal should be input to the X0 pin only and the X1 pin should be kept open. • C Pin As MB91610 series includes an internal regulator, always connect a bypass capacitor of approximately 4.7 μF to the C pin for use by the regulator. • Example of Using an External Clock X0 X1 Open MB91610 series C 4.7 µF GND VSS MB91610 series |
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