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MCP413X Datasheet(PDF) 83 Page - Microchip Technology |
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MCP413X Datasheet(HTML) 83 Page - Microchip Technology |
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83 / 88 page  © 2008 Microchip Technology Inc. DS22060B-page 83 MCP413X/415X/423X/425X APPENDIX A: REVISION HISTORY Revision B (December 2008) The following is the list of modifications: 1. Updated IPU specifications to specify test conditions and new limit. 2. Updated DFN package in “Package Types (top view)”, including Exposed Thermal Pad sample (EP). 3. Added new descriptions in Section 3.0 “Pin Descriptions”. 4. Added new Development Tool support items. 5. Updated Package Outline section. Revision A (September 2007) • Original Release of this Document. APPENDIX B: MIGRATING FROM THE MCP41XXX AND MCP42XXX DEVICES This is intended to give an overview of some of the differences to be aware of when migrating from the MCP41XXX and MCP42XXX devices. B.1 MCP41XXX to MCP41XX Differences Here are some of the differences to be aware of: 1. SI pin is now SDI/SDO pin, and the contents of the device memory can be read. 2. Need to address the Terminal Connect Feature (TCON register) of MCP41XX. 3. MCP41XX supports software Shutdown mode. 4. New 5 k Ω version. 5. MCP41XX have 7-bit resolution options. 6. Alternate pinout versions (for Rheostat configuration). 7. Verify device’s electrical specifications. 8. Interface signals are now high voltage tolerant. 9. Interface signals now have internal pull-up resistors. B.2 MCP42XXX to MCP42XX Differences Here are some of the differences to be aware of: 1. Daisy chaining of devices is no longer supported. 2. SDO pin allows contents of device memory to be read. 3. Need to address the Terminal Connect Feature (TCON register) of MCP42XX. 4. MCP42XX supports software Shutdown mode. 5. New 5 k Ω version. 6. MCP42XX have 7-bit resolution options. 7. Alternate package/pinout versions (for Rheostat configuration). 8. Verify device’s electrical specifications. 9. Interface signals are now high voltage tolerant 10. Interface signals now have internal pull-up resistors. |
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