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PIC18F2420-E/P Datasheet(PDF) 335 Page - Microchip Technology |
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PIC18F2420-E/P Datasheet(HTML) 335 Page - Microchip Technology |
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335 / 412 page ![]() © 2008 Microchip Technology Inc. DS39631E-page 333 PIC18F2420/2520/4420/4520 Module Differential Currents ( ΔIWDT, ΔIBOR, ΔILVD, ΔIOSCB, ΔIAD) D026 ( ΔIAD) A/D Converter 0.2 1.0 μA -40°C to +85°C VDD = 2.0V A/D on, not converting 0.2 1.0 μA -40°C to +85°C VDD = 3.0V 0.2 1.0 μA -40°C to +85°C VDD = 5.0V 0.5 4.0 μA -40°C to +125°C D022 ( ΔIWDT) Watchdog Timer 1.3 2.2 μA-40°C VDD = 2.0V 1.4 2.2 μA+25°C 1.6 2.3 μA+85°C 1.9 3.5 μA-40°C VDD = 3.0V 2.0 3.5 μA+25°C 2.2 3.5 μA+85°C 3.0 7.5 μA-40°C VDD = 5.0V 3.5 7.5 μA+25°C 3.5 7.8 μA+85°C 4.0 10 μA +125°C D022A ( ΔIBOR) Brown-out Reset(4) 35 50 μA -40°C to +85°C VDD = 3.0V 40 55 μA -40°C to +85°C VDD = 5.0V 55 65 μA -40°C to +125°C 02 μA -40°C to +85°C Sleep mode, BOREN<1:0> = 10 05 μA -40°C to +125°C D022B ( ΔILVD) High/Low-Voltage Detect(4) 22 38 μA -40°C to +85°C VDD = 2.0V 25 40 μA -40°C to +85°C VDD = 3.0V 29 45 μA -40°C to +85°C VDD = 5.0V 30 45 μA -40°C to +125°C 26.2 DC Characteristics: Power-Down and Supply Current PIC18F2420/2520/4420/4520 (Industrial) PIC18LF2420/2520/4420/4520 (Industrial) (Continued) PIC18LF2420/2520/4420/4520 (Industrial) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial PIC18F2420/2520/4420/4520 (Industrial, Extended) Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≤ +85°C for industrial -40°C ≤ TA ≤ +125°C for extended Param No. Device Typ Max Units Conditions Legend: Shading of rows is to assist in readability of the table. Note 1: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to VDD or VSS and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.). 2: The supply current is mainly a function of operating voltage, frequency and mode. Other factors, such as I/O pin loading and switching rate, oscillator type and circuit, internal code execution pattern and temperature, also have an impact on the current consumption. The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VDD or VSS; MCLR = VDD; WDT enabled/disabled as specified. 3: When operation below -10°C is expected, use T1OSC High-Power mode, where LPT1OSC (CONFIG3H<2>) = 0. When operation will always be above -10°C, then the low-power Timer1 oscillator may be selected. 4: BOR and HLVD enable internal band gap reference. With both modules enabled, current consumption will be less than the sum of both specifications. |
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