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PCIMX515CJM6C Datasheet(PDF) 138 Page - Freescale Semiconductor, Inc |
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PCIMX515CJM6C Datasheet(HTML) 138 Page - Freescale Semiconductor, Inc |
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138 / 184 page ![]() i.MX51 Applications Processors for Consumer and Industrial Products, Rev. 1 138 Freescale Semiconductor Preliminary—Subject to Change Without Notice Package Information and Contact Assignments 4.1.1 BGA—Case 2058 13 × 13 mm, 0.5 mm Pitch Figure 102. Package: Case 2058—0.5 mm Pitch 4.1.1.1 13 × 13 mm Package Drawing Notes The following notes apply to Figure 102. 1 All dimensions in millimeters. 2 Dimensioning and tolerancing per ASME Y14.5M-1994. 3 Maximum solder ball diameter measured parallel to Datum A. 4 Datum A, the seating plane, is determined by the spherical crowns of the solder balls. 5 Parallelism measurement shall exclude any effect of mark on top surface of package. |
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