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AS8520

Preliminary Data Sheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of

the device at these or any other conditions beyond those indicated in Section 6 Electrical Characteristics on page 7 is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

DC Supply Voltage

VSUP

-0.3

18

V

42

Transient up to 500ms duration

EN

-0.3

VSUP +

0.3

V

-0.3

7

V

LIN

-27

+40

V

VBAT

-27

+42

V

LDRIVE1,

LDRIVE2

-0.3

50

V

RESET, RX, TX, CS,

SCLK, SDO, SDI,

VBAT_DIV

-0.3

V

-100

100

mA

Norm: Jedec 78

Electrostatic Discharge (ESD)

±2

kV

SDO, SDI, VBAT_DIV, EN

±4

For VBAT, VSUP, VSS, LDRIVE1, LDRIVE2

±8

LIN to GND, HBM Model

±6

LIN to GND, IEC6100-4-2

±0.5

LIN to GND, CDM

±0.1

LIN to GND, MM

Total operating power dissipation (all supplies and

0.75

W

QFN 24 in still air, soldered on JEDEC standard board

@125º ambient, static operation = no time limit

33

K/W

Soldered on JEDEC standard board @125º ambient,

static operation = no time limit

-55

+150

ºC

+260

ºC

The reflow peak soldering temperature (body

temperature) is specified according IPC/JEDEC J-

STD-020C “Moisture/Reflow Sensitivity Classification

for Non hermetic Solid State Surface Mount Devices”.

Humidity non-condensing

5

85

%