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dsPIC33FJ32GS608 Datasheet(PDF) 385 Page - Microchip Technology |
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dsPIC33FJ32GS608 Datasheet(HTML) 385 Page - Microchip Technology |
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385 / 416 page ![]() 2009 Microchip Technology Inc. Preliminary DS70591B-page 385 dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610 FIGURE 27-20: QEA/QEB INPUT CHARACTERISTICS TABLE 27-40: DAC OUTPUT BUFFER SPECIFICATIONS DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated) Operating temperature: -40°C TA +85°C for Industrial -40°C TA +125°C for Extended Param. No. Symbol Characteristic Min Typ Max Units Comments DA10 RLOAD Resistive Output Load Impedance 3K — — DA11 CLOAD Output Load Capacitance —20 35 pF DA12 IOUT Output Current Drive Strength 200 300 400 A Sink and source DA13 VRANGE Full Output Drive Strength Voltage Range AVSS + 250 mV —AVDD – 900 mV V DA14 VLRANGE Output Drive Voltage Range at Reduced Current Drive of 50 A AVSS + 50 mV — AVDD – 500 mV V DA15 IDD Current Consumed when Module is Enabled, High-Power Mode —— 1.3 x IOUT A Module will always consume this current even if no load is connected to the output DA16 ROUTON Output Impedance when Module is Enabled —— 10 Closed loop output resistance TQ30 TQ35 TQ31 QEA (input) TQ30 TQ35 TQ31 QEB (input) TQ36 QEB Internal TQ40 TQ41 |
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