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TMS320DM647 Datasheet(PDF) 97 Page - Texas Instruments

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Part # TMS320DM647
Description  Digital Media Processor
PDF  181 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TMS320DM647 Datasheet(HTML) 97 Page - Texas Instruments

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TMS320DM647
TMS320DM648
www.ti.com
SPRS372F – JANUARY 2010 – REVISED SEPTEMBER 2009
6.9.3.3
PCB Stackup
The minimum stackup required for routing the device is a six-layer stack as shown in Table 6-29.
Additional layers may be added to the PCB stack up to accommodate other circuity or to reduce the size
of the PCB footprint.
Table 6-29. Minimum PCB Stack Up
LAYER
TYPE
DESCRIPTION
1
Signal
Top routing mostly horizontal
2
Plane
Ground
3
Plane
Power
4
Signal
Internal routing
5
Plane
Ground
6
Signal
Bottom routing mostly vertical
Complete stack up specifications are provided in Table 6-30.
Table 6-30. PCB Stack Up Specifications
NO.
PARAMETER
MIN
TYP
MAX
UNIT
1
PCB Routing/Plane Layers
6
2
Signal Routing Layers
3
3
Full ground layers under DDR2 routing Region
2
4
Number of ground plane cuts allowed within DDR routing region
0
5
Number of ground reference planes required for each DDR2 routing layer
1
6
Number of layers between DDR2 routing layer and reference ground plane
0
7
PCB Routing Feature Size
4
Mils
8
PCB Trace Width w
4
Mils
8
PCB BGA escape via pad size
18
Mils
9
PCB BGA escape via hole size
8
Mils
10
DSP Device BGA pad size(1)
11
DDR2 Device BGA pad size(2)
12
Single Ended Impedance, Zo
50
75
13
Impedance Control(3)
Z-5
Z
Z+5
(1)
See the Flip Chip Ball Grid Array Package Reference Guide (SPRU811) for DSP device BGA pad size.
(2)
See the DDR2 device manufacturer documenation for the DDR2 device BGA pad size.
(3)
Z is the nominal singled ended impedance selected for the PCB specified by item 12.
6.9.3.4
Placement
Figure 6-13 shows the required placement for the device as well as the DDR2 devices. The dimensions
for Figure 6-13 are defined in Table 6-31. The placement does not restrict the side of the PCB where the
devices are mounted. The purpose of the placement is to limit the maximum trace lengths and allow for
proper routing space. For 16-bit DDR memory systems, the high word DDR2 device is omitted from the
placement.
Copyright © 2010–2009, Texas Instruments Incorporated
Peripheral Information and Electrical Specifications
97
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Product Folder Link(s): TMS320DM647 TMS320DM648



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