PIC18F23K20-ESLASHML datasheet(441/456 Pages) MICROCHIP

441 / 456 page

 2010 Microchip Technology Inc.

DS41303G-page 441

PIC18F2XK20/4XK20

APPENDIX A:

REVISION HISTORY

Revision A (07/2006)

Original data sheet for PIC18F2XK20/4XK20 devices.

Revision B (03/2007)

Added

part

numbers

PIC18F26K20

and

PIC18F46K20;

Replaced

Development

Support

Section; Replaced Package Drawings.

Revision C (10/2007)

Revised Table 1, DIL Pins 34 and 35; Table 2, Pins 22

and 24; Table 1-2, Pins RB1 and RB3; Table 1-3, Pins

RB1 and RB3; Revised Sections 4.3, 4.4, 4.4.1, 4.4.2,

4.4.4; Revised Table 4-3, Note 2; Revised Table 6-1;

Revise Section 7.8: Revised Section 9.2; Revised

Examples 10-1 and 10-2; Revised Table 10-3, Pins

RB1 and RB3; Revised Sections 12.2 through 12.5;

Revised Register 16-1, bit 3-0; Revised Sections 16.1,

16.2, 16.4.4; Revised Register 16-2, bit 6-4; Revised

Table 16-2, Note 2; Revised Register 17-1, bit 6;

Revised Register 17-3; Revised Table 17-4; Revised

bits 5 and 4; Revised Register 23-4, bit 1; Revised Reg-

ister 23-12, bit 7-5; Revised Section 23.3; Revised Sec-

tion 24.1.1, instruction set descriptions; Revised

Section 26.0, voltage on MCLR; Revised DC Charac-

teristics 26.2, 26.3, 26.4 26.5, 26.6, 26.7, 26.8 and

26.10; Revised Tables 26-1, 26-6, 26-7, 26-9, 26-23.

Revision D (08/2008)

Update to Peripheral Highlights (USART module);

Deleted Section 2.2.6 (Oscillator Transitions); Revised

Sections 2.5.3, 2.9; Added Section 2.9.3 (Clock Switch

Timing); Deleted Section 2.10.4 (Clock Switching Tim-

ing); Replaced BAUDCTL with BAUDCON throughout;

Revised Table 5-2 (PLUSW0, PLUSW1, PLUSW2);

Add Note 1 to Table 7-1 (EEADRH); Revised Section

6.4.4 and Register 16-2 (FLT0 pin); Revised Registers

17-2 and 17-5 (SSPEN); Revised Register 17-6

(SEN); Added new paragraph after Figure 18-2;

Revised Note, Section 18.1.1; Deleted Note, Section

18.1.2; Added new Note 2, Sections 18.1.2.9 and

18.1.2.10; Revised Note 1, Section 18.3.1; Added

Section 18.3.2; Revised Section 18.3.5; Added new

Note

Sections

18.4.1.5,

18.4.1.10,

18.4.2.2,

18.4.2.4; Revised Register 21-1 (CVR); Revised Note

1, Registers 23-6, 23.8, 23-10, Table 23-3; Added new

Figure 26-1; Revised 26.2, 26.6, 26.7 (Note 3), 26.8,

26.9, 26.10; Revised Tables 26-1, 26-2, 26-3, 26-6, 26-

7, 26-8, 26-25; Updated Package Drawings.

Revision E (04/2009)

Revised data sheet title; Revised Power-Managed

Modes, Peripheral Highlights, and Analog Features;

Revised 26.2, DC Char. table.

Revision F (09/2009)

Changed the values in the “Extreme Low-Power

Management with nanoWatt XLP” section; Added new

Note

Diagrams;

Updated

Electrical

Characteristics section; Added charts to the DS

Characteristics section; Removed Preliminary label;

Added UQFN to Pin Diagrams; Added the 28-pin

UQFN to Table 3-1; Updated MSSP section (Register

17-3; changing SSPADD<6:0> to SSPADD<7:0>);

Updated the Development Support section deleting

section 25.7; Added the 28-Lead UQFN package

marking diagrams and the 28-Lead Plastic Ultra Thin

Quad Flat, No Lead Package (MV) - 4X4X0.5 mm Body

(UQFN) package to Packaging Information section;

Other minor corrections.

Revision G (01/2010)

Updated Figure 9-1; Reviewed Section 26 (Electrical

Characteristics); Added Figures 27-29, 27-30, 27-31

and 27-32 to Section 27 (DC and AC Characteristics

Graphs and Tables); Reviewed Product Identification

System section.

PIC18F23K20-E/ML Datasheet(PDF) 441 Page - Microchip Technology

PIC18F23K20-E/ML Datasheet(HTML) 441 Page - Microchip Technology

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

Datasheet Download

Link URL