TMS320DM647 datasheet(98/181 Pages) TI

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OFFSET

RecommendedDDR2Device

Orientation

OFFSET

DDR2

Device

DM648

DDR2Device

TMS320DM647

TMS320DM648

SPRS372F – JANUARY 2010 – REVISED SEPTEMBER 2009

www.ti.com

DM648 is shown in this figure as an example of the device and represents the entire set of devices that include:

DM647/DM648.

Figure 6-13. DDR2 Device Placement

Table 6-31. Placement Specifications

NO.

PARAMETER

MIN

MAX

UNIT

X(1) (2)

1660

Mils

Y(1) (2)

1280

Mils

Y Offset(1) (2) (3)

650

Mils

DDR2 Keepout Region(4)

Clearance from non-DDR2 signal to DDR2 Keepout Region(5)

(1)

See Figure 6-11 for dimension defintions.

(2)

Measurements from center of DSP device to center of DDR2 device.

(3)

For 16-bit memory systems, it is recommended that Y Offset be as small as possible.

(4)

DDR2 Keepout region to encompass entire DDR2 routing area

(5)

Non-DDR2 signals allowed within DDR2 keepout region provided they are separated from DDR2 routing layers by a ground plane.

6.9.3.5

DDR2 Keep Out Region

The region of the PCB used for the DDR2 circuitry must be isolated from other signals. The DDR2 keep

out region is defined for this purpose and is shown in Figure 6-14. The size of this region varies with the

placement and DDR routing. Additional clearances required for the keep out region are shown in

Table 6-31.

Figure 6-14. DDR2 Keepout Region

Peripheral Information and Electrical Specifications

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Product Folder Link(s): TMS320DM647 TMS320DM648

TMS320DM647 Datasheet(PDF) 98 Page - Texas Instruments

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