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ST10F276Z5 Datasheet(PDF) 192 Page - STMicroelectronics

Part # ST10F276Z5
Description  16-bit MCU with MAC unit, 832 Kbyte Flash memory and 68 Kbyte RAM
PDF  239 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

ST10F276Z5 Datasheet(HTML) 192 Page - STMicroelectronics

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Electrical characteristics
ST10F276Z5
192/239
Input leakage and external circuit
The series resistor utilized to limit the current to a pin (see RL in Figure 47), in combination
with a large source impedance, can lead to a degradation of A/D converter accuracy when
input leakage is present.
Data about maximum input leakage current at each pin is provided in the datasheet (Electri-
cal Characteristics section). Input leakage is greatest at high operating temperatures and in
general decreases by one half for each 10°C decrease in temperature.
Considering that, for a 10-bit A/D converter one count is about 5mV (assuming VAREF =
5 V), an input leakage of 100nA acting though an RL = 50kΩ of external resistance leads to
an error of exactly one count (5mV); if the resistance were 100k
Ω, the error would become
two counts.
Eventual additional leakage due to external clamping diodes must also be taken into
account in computing the total leakage affecting the A/D converter measurements. Another
contribution to the total leakage is represented by the charge sharing effects with the sam-
pling capacitance: CS being substantially a switched capacitance, with a frequency equal to
the conversion rate of a single channel (maximum when fixed channel continuous conver-
sion mode is selected), it can be seen as a resistive path to ground. For instance, assuming
a conversion rate of 250 kHz, with CS equal to 4 pF, a resistance of 1MΩ is obtained (REQ =
1 / fCCS, where fC represents the conversion rate at the considered channel). To minimize
the error induced by the voltage partitioning between this resistance (sampled voltage on
CS) and the sum of RS + RF + RL + RSW + RAD, the external circuit must be designed to
respect the following relation:
The formula above places constraints on external network design, in particular on resistive
path.
A second aspect involving the capacitance network must be considered. Assuming the three
capacitances CF, CP1 and CP2 are initially charged at the source voltage VA (refer to the
equivalent circuit shown in Figure 47), when the sampling phase is started (A/D switch
close), a charge sharing phenomena is installed.
Figure 48.
Charge sharing timing diagram during sampling phase
VA
RS RF RL RSW RAD
++
+
+
REQ
------------------------------------------------------------------------------
⋅
1
2
--- LSB
<
VA
VA1
VA2
t
TS
VCS
Voltage Transient on CS
∆V < 0.5 LSB
1
2
τ
1 < (RSW + RAD) CS << TS
τ
2 = RL (CS + CP1 + CP2)



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