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MPC8572ECLPXATLD Datasheet(PDF) 100 Page - Freescale Semiconductor, Inc |
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MPC8572ECLPXATLD Datasheet(HTML) 100 Page - Freescale Semiconductor, Inc |
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100 / 140 page  MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 4 100 Freescale Semiconductor Package Description 18 Package Description This section describes package parameters, pin assignments, and dimensions. 18.1 Package Parameters for the MPC8572E FC-PBGA The package parameters are as provided in the following list. The package type is 33 mm × 33 mm, 1023 flip chip plastic ball grid array (FC-PBGA). Package outline 33 mm × 33 mm Interconnects 1023 Ball Pitch 1 mm Ball Diameter (Typical) 0.6 mm Solder Balls 63% Sn 37% Pb Solder Balls (Lead-Free) 96.5% Sn 3.5% Ag |
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