ADL5502ACBZ-P2 datasheet(22/28 Pages) AD

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ADL5502

Rev. A | Page 22 of 28

OPERATION AT HIGH FREQUENCIES

The ADL5502 works at high frequencies but exhibits slightly

higher linearity error. Figure 61 and Figure 62 show the linearity

error distributions for VRMS and PEAK of 50 devices at 6000 MHz

over temperature. The typical slopes at 6000 MHz are 0.87 V/V rms

and 0.58 V/V rms for VRMS and PEAK, respectively. The intercepts

at 6000 MHz are 0.002 V and 0.005 V for each respective output.

–3

–2

–1

INPUT (dBm)

–25

–20

–15

–10

–5

Figure 61. VRMS Output Temperature Drift from +25°C Linear Reference

for 50 Devices at −40°C, +25°C, and +85°C, 6000 MHz, Supply 3.0 V

–3

–2

–1

INPUT (dBm)

–25

–20

–15

–10

–5

Figure 62. PEAK Output Temperature Drift from +25°C Linear Reference

for 50 Devices at −40°C, +25°C, and +85°C, 6000 MHz, Supply 3.0 V

Due to the repeatability of the performance from part to part,

compensation can be applied to reduce the effects of temperature

drift and linearity error. To detect larger dynamic ranges at

higher frequencies, the transfer function at ambient temperature

can be calibrated, thus eliminating the linearity error. This

technique is discussed in detail in the Calibration for Improved

Accuracy section. Figure 63 and Figure 64 show the temperature

drift distributions for both outputs of 50 devices at 6000 MHz.

–3

–2

–1

INPUT (dBm)

–25

–20

–15

–10

–5

Figure 63. VRMS Output Delta from +25°C Output Voltage for

50 Devices at −40°C and +85°C, Frequency 6000 MHz, Supply 3.0 V

–3

–2

–1

INPUT (dBm)

–25

–20

–15

–10

–5

Figure 64. PEAK Output Delta from +25°C Output Voltage for

50 Devices at −40°C and +85°C, Frequency 6000 MHz, Supply 3.0 V

DEVICE HANDLING

The wafer-level chip scale package consists of solder bumps

connected to the active side of the die. The part is lead-free with

95.5% tin, 4.0% silver, and 0.5% copper solder bump composition.

The WLCSP can be mounted on printed circuit boards using

standard surface-mount assembly techniques; however, caution

should be taken to avoid damaging the die. See the AN-617

Application Note, MicroCSP Wafer Level Chip Scale Package, for

additional information. WLCSP devices are bumped die; therefore,

the exposed die can be sensitive to light, which can influence

specified limits. Lighting in excess of 600 lux can degrade

performance.

ADL5502ACBZ-P2 Datasheet(PDF) 22 Page - Analog Devices

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