2.3

Lead-free soldering processes

EPCOS multilayer CTVS with AgNiSn termination are designed for the requirements of lead-free

soldering processes only.

Soldering temperature profiles to JEDEC J-STD-020D, IEC 60068-2-58 and ZVEI recommenda-

tions.

3

Recommended soldering methods - type-specific releases by EPCOS

3.1

Overview

Reflow soldering

Wave soldering

Type

Case size

SnPb

Lead-free

SnPb

Lead-free

CT... / CD...

0201/ 0402

Approved

Approved

No

No

CT... / CD...

0603 ... 2220

Approved

Approved

Approved

Approved

CN...

0603 ... 2220

Approved

No

Approved

No

CN...K2

1812, 2220

Approved

Approved

No

No

Arrays

0405 ... 1012

Approved

Approved

No

No

ESD/EMI filters 0405, 0508

Approved

Approved

No

No

CU

3225, 4032

Approved

Approved

Approved

Approved

SHCV

-

No

No

Approved

Approved

3.2

Nickel barrier and AgPt terminated multilayer CTVS

All EPCOS MLVs with nickel barrier and AgPt termination are suitable and fully qualiyfied for lead-

free soldering. The nickel barrier layer is 100% matte tin-plated.

3.3

Silver-palladium terminated MLVs

AgPd-terminated MLVs are mainly designed for conductive adhesion technology on hybrid materi-

al. Additionally MLVs with AgPd termination are suitable for reflow and wave soldering with SnPb

solder.

Note:

Lead-free soldering is not approved for MLVs with AgPd termination.

3.4

Silver-platinum terminated MLVs

The silver-platinum termination is approved for reflow soldering, SnPb soldering and lead-free

with a silver containing solder paste. In case of SnPb soldering, a solder paste Sn62Pb36Ag2 is

recommended. For lead-free reflow soldering, a solder paste SAC, e.g. Sn95.5Ag3.8Cu0.7, is

recommended.

SMD disk varistors (CU varistors)

Automotive series

Page 18 of 30

Please read Cautions and warnings and

Important notes at the end of this document.