W25Q32BVZPAP datasheet(4/79 Pages) WINBOND

4 / 79 page

W25Q32BV

7.2.38

Program Security Registers (42h) ......................................................................................61

- 4 -

7.2.39

Read Security Registers (48h) ...........................................................................................62

ELECTRICAL CHARACTERISTICS............................................................................................... 63

8.1

Absolute Maximum Ratings................................................................................................ 63

8.2

Operating Ranges............................................................................................................... 63

8.3

Power-up Timing and Write Inhibit Threshold .................................................................... 64

8.4

DC Electrical Characteristics .............................................................................................. 65

8.5

AC Measurement Conditions.............................................................................................. 66

8.6

AC Electrical Characteristics .............................................................................................. 67

8.7

AC Electrical Characteristics (cont’d) ................................................................................. 68

8.8

Serial Output Timing........................................................................................................... 69

8.9

Serial Input Timing.............................................................................................................. 69

8.10

/HOLD Timing..................................................................................................................... 69

8.11

/WP Timing......................................................................................................................... 69

PACKAGE SPECIFICATION .......................................................................................................... 70

9.1

8-Pin SOIC 208-mil (Package Code SS)............................................................................ 70

9.2

8-Pin PDIP 300-mil (Package Code DA) ............................................................................ 71

9.3

8-Pad WSON 6x5mm (Package Code ZP) ........................................................................ 72

9.4

8-Pad WSON 8x6mm (Package Code ZE) ........................................................................ 74

9.5

16-Pin SOIC 300-mil (Package Code SF) .......................................................................... 75

9.6

24-Ball TFBGA 8x6-mm (Package Code TC) .................................................................... 76

10.

ORDERING INFORMATION .......................................................................................................... 77

10.1

Valid Part Numbers and Top Side Marking ........................................................................ 78

11.

REVISION HISTORY...................................................................................................................... 79

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