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Release Date:2011-12-09 16:32:40.0

DATASHEET

EHP- B05 Series

1

Copyright © 2011, Everlight All Rights Reserved. Release Date: 12.01.2011. Issue No: DHE-0001726

www.everlight.com

Introduction

B05 series to be a high power, multi-chip device with very low

thermal resistance as a result of the PCB substrate. The series

is a surface-mount high-power device featuring high brightness

that is suitable for all kinds of lighting applications such as

general illumination, spot, signal, industrial and commercial lighting.

Features

Applications



Small package with high efficiency



ESD protection up to 8KV



Soldering method: SMT



Binning Parameters: Brightness,

Forward Voltage ,Wavelength and

Chromaticity



Moisture Sensitivity Level: 3



RoHS compliant



Matches ANSI binning



Reliability testing conforms to IESNA

LM80 Lumen maintenance test method



General Lighting



Decorative and Entertainment

Lighting



Signal and Symbol Luminaries for

orientation marker lights (e.g. steps,

exit ways, etc.)



Agriculture Lighting

EHP-B05 series