SY89876L_0708 datasheet(3/10 Pages) MICREL

3 / 10 page

Precision Edge®

SY89876L

Micrel, Inc.

M9999-082407

hbwhelp@micrel.com or (408) 955-1690

Note 1.

Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is

not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratlng

conditions for extended periods may affect device reliability.

Note 2.

The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.

Note 3.

Due to the limited drive capability use for input of the same package only.

Note 4.

Junction-to-board resistance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential on the PCB.

Absolute Maximum Ratings(Note 1)

Supply Voltage (V

CC) ................................... –0.5V to +4.0V

Input Voltage (V

IN) ................................... –0.5V to VCC+0.3

ECL Output Current (I

OUT)

Continuous .......................................................... 50mA

Surge ................................................................. 100mA

Input Current IN, /IN (I

IN) ......................................... ±50mA

T Current (IVT) ...................................................... ±100mA

REF-AC Sink/Source Current (IVREF-AC), Note 3 ...... ±2mA

Lead Temperature (soldering 20 sec.) ...................... 260°C

Storage Temperature (T

S) ........................ –65°C to +150°C

Operating Ratings(Note 2)

Supply Voltage (V

CC) ....................................... +3.3V ±10%

Ambient Temperature (T

A) ......................... –40°C to +85°C

Package Thermal Resistance

MLF®

(θ

JA)

Still-Air ............................................................. 60°C/W

500lfpm ........................................................... 54°C/W

MLF®

(ψ

JB), Note 4

Junction-to-Board ............................................ 32°C/W

A= –40°C to +85°C; Unless otherwise stated.

Symbol

Parameter

Condition

Min

Typ

Max

Units

Power Supply

3.0

3.6

Power Supply Current

No load, max. V

100

Differential Input Resistance

100

110

(IN-to-/IN)

Input High Voltage (IN, /IN)

Note 2

0.1

–

CC+0.3

Input Low Voltage (IN, /IN)

Note 2

–0.3

–

IH–0.1

Input Voltage Swing

Note 3

0.1

–

DIFF_IN

Differential Input Voltage Swing

Note 4

0.2

–

IN|

Input Current (IN, /IN)

Note 2

––

REF–AC

Reference Voltage

Note 5

CC–1.525 VCC–1.425 VCC–1.325

Note 1.

The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.

Note 2.

Specification for packaged product only.

Note 3.

Due to the internal termination (see Figure 2a) the input current depends on the applied voltages at IN, /IN and VT inputs. Do not apply a combination

of voltages that causes the input current to exceed the maximum limit!

Note 4.

See “Timing Diagram” for V

IN definition. VIN (Max) is specified when VT is floating.

Note 5.

See “Typical Operating Characteristics” section for VDIFF definition.

Note 6.

Operating using V

IN is limited to AC-coupled PECL or CML applications only. Connect directly to VT pin.

DC ELECTRICAL CHARACTERISTICS(Notes 1, 2)

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