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MPC8378E Datasheet(PDF) 90 Page - Freescale Semiconductor, Inc |
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MPC8378E Datasheet(HTML) 90 Page - Freescale Semiconductor, Inc |
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90 / 128 page ![]() MPC8378E PowerQUICC II Pro Processor Hardware Specifications, Rev. 8 90 Freescale Semiconductor This figure shows the mechanical dimensions and bottom surface nomenclature of the TEPBGA II package. Figure 66. Mechanical Dimensions and Bottom Surface Nomenclature of the TEPBGA II Note: 1 All dimensions are in millimeters. 2 Dimensioning and tolerancing per ASME Y14. 5M-1994. 3 Maximum solder ball diameter measured parallel to Datum A. 4 Datum A, the seating plane, is determined by the spherical crowns of the solder balls. |
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