THS6204IPWPR datasheet(30/43 Pages) TI

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POWER CONTROL OPERATION

THERMAL INFORMATION

DEVICE PROTECTION FEATURE

DIE

SideView(a)

EndView(b)

BottomView(c)

Thermal

Pad

THS6204

SBOS416C – OCTOBER 2007 – REVISED APRIL 2009 ................................................................................................................................................... www.ti.com

automatically turns the device back on. This occurs at

approximately +145°C, junction temperature. Note

The THS6204 provides a power control feature that

that

the

THS6204

does

not

have

short-circuit

may be used to reduce system power. The four

protection and care should be taken to minimize the

modes of operation for this power control feature are

output current below the absolute maximum ratings.

full-power, power cutback, idle state, and power

shutdown. These four operating modes are set

through two logic lines A0 and A1. Table 4 shows the

different modes of operation.

The THS6204 is available in thermally-enhanced

RHF and PWP packages, which are members of the

Table 4. Power Control Mode of Operation

PowerPAD family of packages. These packages are

constructed using leadframes upon which the dies

MODE OF

are mounted (see Figure 88 for the RHF package and

OPERATION

BIAS 1

BIAS 2

Figure 89 for the PWP package). This arrangement

Full bias mode

results in the lead frames being exposed as thermal

Mid bias mode

pads on the underside of their respective packages.

Low bias mode

Because a thermal pad has direct thermal contact

Shutdown

with the die, excellent thermal performance can be

achieved by providing a good thermal path away from

The full-power mode is used for normal operating

the

thermal

pad.

Note

that

the

PowerPAD

condition. The power cutback mode brings the

electronically isolated from the active circuitry and

quiescent power to 13.5mA. The idle state mode

any pins. Thus, the PowerPAD can be connected to

keeps a low output impedance but reduces output

any potential voltage within the absolute maximum

power and bandwidth. The shutdown mode has a

voltage range. Ideally, connection of the PAD to the

high output impedance as well as the lowest

most negative supply plane is preferred.

quiescent power (0.5mA).

The PowerPAD package allows for both assembly

If the Bias 1 and Bias 2 pins are left unconnected, the

and thermal management in one manufacturing

THS6204 shuts down.

operation. During the surface-mount solder operation

(when the leads are being soldered), the thermal pad

can also be soldered to a copper area underneath the

package. Through the use of thermal paths within this

The THS6204 has a built-in thermal protection

copper area, heat can be conducted away from the

feature. Should the internal junction temperature rise

package into either a ground plane or other heat

above

approximately

+160°C,

the

device

dissipating device. This is discussed in more detail in

automatically shuts down. Such a condition could

the

PCB

design

considerations

section

this

exist with improper heat sinking or if the output is

document.

shorted to ground. When the abnormal condition is

fixed,

the

internal

thermal

shutdown

circuit

(1) The thermal pad is electrically isolated from all terminals in the package.

Figure 88. Views of Thermally-Enhanced RHF Package (Representative Only—Not to Scale)

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