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SPC5604BF2MLL6 Datasheet(PDF) 37 Page - Freescale Semiconductor, Inc |
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SPC5604BF2MLL6 Datasheet(HTML) 37 Page - Freescale Semiconductor, Inc |
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37 / 109 page ![]() Package pinouts and signal descriptions MPC5604B/C Microcontroller Data Sheet, Rev. 11 Freescale Semiconductor 37 3.14 Thermal characteristics 3.14.1 Package thermal characteristics Table 15. LQFP thermal characteristics1 1 Thermal characteristics are based on simulation. Symbol C Parameter Conditions2 Pin count Value Unit RJA CC D Thermal resistance, junction-to-ambient natural convection3 Single-layer board - 1s 64 60 °C/W 100 64 144 64 Four-layer board - 2s2p 64 42 100 51 144 49 RJB CC D Thermal resistance, junction-to-board4 Single-layer board - 1s 64 24 °C/W 100 36 144 37 Four-layer board - 2s2p 64 24 100 34 144 35 RJC CC D Thermal resistance, junction-to-case5 Single-layer board - 1s 64 11 °C/W 100 22 144 22 Four-layer board - 2s2p 64 11 100 22 144 22 JB CC D Junction-to-board thermal characterization parameter, natural convection Single-layer board - 1s 64 TBD °C/W 100 33 144 34 Four-layer board - 2s2p 64 TBD 100 34 144 35 JC CC D Junction-to-case thermal characterization parameter, natural convection Single-layer board - 1s 64 TBD °C/W 100 9 144 10 Four-layer board - 2s2p 64 TBD 100 9 144 10 |
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