VND830P-E datasheet(7/27 Pages) STMICROELECTRONICS

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VND830P-E

Electrical specifications

Doc ID 17546 Rev 2

7/27

2.2

Thermal data

2.3

Electrical characteristics

Values specified in this section are for 8 V < VCC < 36 V; -40 °C < Tj < 150 °C, unless

otherwise stated.

(Per each channel)

Figure 3.

Current and voltage conventions

VFn = VCCn - VOUTn during reverse battery condition.

Table 4.

Thermal data (per island)

Symbol

Parameter

Value

Unit

Rthj-lead

Thermal resistance junction-lead (max)

°C/W

Rthj-amb

Thermal resistance junction-ambient (max)

65(1)

48(2)

°C/W

When mounted on a standard single-sided FR-4 board with 0.5 cm2 of Cu (at least 35 µm thick) connected to all VCC pins.

Horizontal mounting and no artificial air flow.

When mounted on a standard single-sided FR-4 board with 6 cm2 of Cu (at least 35 µm thick) connected to all VCC pins.

Horizontal mounting and no artificial air flow.

Table 5.

Power output

Symbol

Parameter

Test conditions

Min.

Typ.

Max. Unit

VCC

(1)

Operating supply voltage

5.5

VUSD

(1)

Undervoltage shutdown

5.5

VOV

(1)

Overvoltage shutdown

RON

On-state resistance

IOUT = 2 A; Tj = 25 °C

IOUT = 2 A; VCC > 8 V

120

IGND

OUTPUT 2

VCC

GND

STATUS 2

INPUT 2

IOUT2

IIN2

ISTAT2

VSTAT2

VIN2

VCC

VOUT2

OUTPUT 1

IOUT1

VOUT1

INPUT 1

IIN1

STATUS 1

ISTAT1

VIN1

VSTAT1

VF1

(1)

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